Development of a multimaterial additive manufacturing process for electronic devices

摘要

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system.\ud\udThrough DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer-by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure.\ud\udOn the other hand, photosensitive resins have been filled with Low Temperature Co-firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order to validate this technology.